Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of
Optical Inspection of Microsystems
โ Scribed by Wolfgang Osten
- Year
- 2019
- Tongue
- English
- Leaves
- 585
- Edition
- 2
- Category
- Library
No coin nor oath required. For personal study only.
โฆ Table of Contents
Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface to Second Edition
Preface to First Edition
Editor
Contributors
Chapter 1: Image Processing and Computer Vision for MEMS Testing
Chapter 2: Surface Features
Chapter 3: A Metrological Characteristics Approach to Uncertainty in Surface Metrology
Chapter 4: Image Correlation Techniques for Microsystems Inspection
Chapter 5: Light Scattering Techniques for the Inspection of Microcomponents and Structures
Chapter 6: Characterization and Measurement of Microcomponents with the Atomic Force Microscope (AFM)
Chapter 7: Optical Profiling Techniques for MEMS Measurement
Chapter 8: Grid and Moirรฉ Methods for Micromeasurements
Chapter 9: Grating (Moirรฉ) Interferometry for In-Plane Displacement and Strain Measurement of Microcomponents
Chapter 10: Interference Microscopy Techniques for Microsystem Characterization
Chapter 11: Measuring MEMS in Motion by Laser Doppler Vibrometry
Chapter 12: An Interferometric Platform for Static, Quasi-Static, and Dynamic Evaluation of Out-of-Plane Deformations of MEMS and MOEMS
Chapter 13: Optoelectronic Holography for Testing Electronic Packaging and MEMS
Chapter 14: Digital Holography and Its Application in MEMS/MOEMS Inspection
Chapter 15: Speckle Metrology for Microsystem Inspection
Chapter 16: Spectroscopic Techniques for MEMS Inspection
Chapter 17: Sensor Fusion in Multiscale Inspection Systems
Index
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