✦ LIBER ✦

On the external inductive coupling of differential signalling on printed circuit boards

✍ Scribed by Leone, M.; Navratil, V.

Book ID: 114624202
Publisher: IEEE
Year: 2004
Tongue: English
Weight: 380 KB
Volume: 46
Category: Article
ISSN: 0018-9375
DOI: 10.1109/temc.2004.823611

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

On the coupling of an external electroma

On the coupling of an external electromagnetic field to a printed circuit board trace

✍ Leone, M.; Singer, H.L. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 345 KB

Calculating Radiated Emissions Due to I/

Calculating Radiated Emissions Due to I/O Line Coupling on Printed Circuit Boards Using the Imbalance Difference Method

✍ Changyi Su; Hubing, T.H. 📂 Article 📅 2012 🏛 IEEE 🌐 English ⚖ 608 KB

A signal path grouping algorithm for fas

A signal path grouping algorithm for fast detection of short circuits on printed circuit boards

✍ Yiu-Wing Leung 📂 Article 📅 1994 🏛 IEEE 🌐 English ⚖ 470 KB

Investigation of the radiation from para

Investigation of the radiation from parallel-plane power-bus structures on printed circuit boards

✍ M. Leone; T. Fischer; M. Albach 📂 Article 📅 2003 🏛 Springer 🌐 English ⚖ 395 KB

The inspection of solder joints on print

The inspection of solder joints on printed circuit boards by phase-shift holographic interferometry

✍ Y.G. Lu; L.Z. Jiang; L.X. Zou; W.Z. Geng; J. Hong 📂 Article 📅 1990 🏛 Elsevier Science ⚖ 700 KB

The influence of a plate-type heat sink

The influence of a plate-type heat sink on the interference between adjacent printed circuit boards: the case of capacitive coupling

✍ Junpei Nonaka; Shuichi Nitta; Atsuo Mutoh 📂 Article 📅 2001 🏛 John Wiley and Sons 🌐 English ⚖ 185 KB 👁 1 views

Increases in the power density per unit volume of an IC due to higher density of integration and higher operating speed cause increased heat generation. In order to avoid undesirable effects of the temperature increase on the reliability of the devices, heat sinks are installed. However, although mu