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On the effect of stacking fault energy on the thermal activation of attractive juntions in the low-temperature creep of F.C.C. metals

✍ Scribed by Y.V.R.K. Prasad; D.H. Sastry; K.I. Vasu

Book ID
116057592
Publisher
Elsevier Science
Year
1970
Weight
108 KB
Volume
4
Category
Article
ISSN
0036-9748

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