Effect of stacking-fault energy on thermal activation of attractive junctions in change-in-stress creep of FCC metals

✍ Scribed by Y. V. R. K. Prasad; D. H. Sastry; K. I. Vasu

• Publisher: Springer
• Year: 1970
• Tongue: English
• Weight: 877 KB
• Volume: 5
• Category: Article
• ISSN: 0022-2461
• DOI: 10.1007/bf00556037