𝔖 Bobbio Scriptorium
✦   LIBER   ✦

On Analysis of Copper, Tin and Silicon Alloys


Book ID
126125043
Publisher
American Chemical Society
Year
1914
Weight
335 KB
Volume
6
Category
Article
ISSN
0095-9014

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πŸ“œ SIMILAR VOLUMES


Hardness of Copper-Tin Alloys
✍ MALLOCK, A. πŸ“‚ Article πŸ“… 1926 πŸ› Nature Publishing Group 🌐 English βš– 247 KB
MΓΆssbauer studies on electrodeposited ti
✍ J. JaΓ©n; A. VΓ©rtes; K.M. Tjutina; L.V. Kasmodamianskaya; L. Kiss; E.V. Shepeleva πŸ“‚ Article πŸ“… 1985 πŸ› Elsevier Science 🌐 English βš– 354 KB

Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and