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On the Constitution of Copper-Tin Alloys

✍ Scribed by Heycock, C. T.; Neville, F. H.


Book ID
120125487
Publisher
The Royal Society
Year
1902
Weight
412 KB
Volume
69
Category
Article
ISSN
0365-0855

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πŸ“œ SIMILAR VOLUMES


Hardness of Copper-Tin Alloys
✍ MALLOCK, A. πŸ“‚ Article πŸ“… 1926 πŸ› Nature Publishing Group 🌐 English βš– 247 KB
MΓΆssbauer studies on electrodeposited ti
✍ J. JaΓ©n; A. VΓ©rtes; K.M. Tjutina; L.V. Kasmodamianskaya; L. Kiss; E.V. Shepeleva πŸ“‚ Article πŸ“… 1985 πŸ› Elsevier Science 🌐 English βš– 354 KB

Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and