Numerical simulation of copper filling within mesoporous silicon by electrodeposition

✍ Scribed by Fukami, Kazuhiro ;Chourou, Mohamed L. ;Sakka, Tetsuo ;Ogata, Yukio H.

• Book ID: 105365952
• Publisher: John Wiley and Sons
• Year: 2010
• Tongue: English
• Weight: 314 KB
• Volume: 208
• Category: Article
• ISSN: 0031-8965
• DOI: 10.1002/pssa.201000087