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Filling of mesoporous silicon with copper by electrodeposition from an aqueous solution

✍ Scribed by Kazuhiro Fukami; Yuki Tanaka; Mohamed L. Chourou; Tetsuo Sakka; Yukio H. Ogata

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Numerical simulation of copper filling w

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Filling of microvia with an aspect ratio

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Adsorption of copper by aminopropyl func

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Removal of copper from aqueous solution

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Removal of copper from aqueous solution

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Removal of copper(II) from an aqueous so

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