✦ LIBER ✦

Numerical analysis of a new model for the processes of the one-dimensional case of metal crystallization

✍ Scribed by Yu. G. Rykov; N. A. Zaitsev

Book ID: 111475044
Publisher: SP MAIK Nauka/Interperiodica
Year: 2011
Tongue: English
Weight: 477 KB
Volume: 3
Category: Article
ISSN: 2070-0482
DOI: 10.1134/s2070048211040107

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A model of one-dimensional metal (the dy

A model of one-dimensional metal (the dynamical solution)

✍ J. Hronek 📂 Article 📅 1991 🏛 Springer 🌐 English ⚖ 386 KB

Numerical analysis of the influence of u

Numerical analysis of the influence of ultrasonic vibration on crystallization processes

✍ B. Ubbenjans; Ch. Frank-Rotsch; J. Virbulis; B. Nacke; P. Rudolph 📂 Article 📅 2011 🏛 John Wiley and Sons 🌐 English ⚖ 566 KB

Comparison of numerical solutions of the

Comparison of numerical solutions of the Navier—Stokes equations and a kinetic model in the one-dimensional case

✍ A. A. Makhmudov; S. P. Popov 📂 Article 📅 1980 🏛 Springer 🌐 English ⚖ 326 KB

A new method for the excitations of the

A new method for the excitations of the one-dimensional Hubbard model

✍ A. Klümper; A. Schadschneider; J. Zittartz 📂 Article 📅 1990 🏛 Springer 🌐 English ⚖ 880 KB

On the sublimation growth of SiC bulk cr

On the sublimation growth of SiC bulk crystals: development of a numerical process model

✍ Dieter Hofmann; Marcus Heinze; Albrecht Winnacker; Franz Durst; Lev Kadinski; Pe 📂 Article 📅 1995 🏛 Elsevier Science 🌐 English ⚖ 444 KB

Numerical and experimental processes for

Numerical and experimental processes for the analysis of a wire antenna mounted on a metallic body

✍ H. Jeuland; B. Uguen; G. Chassay; E. Grorud 📂 Article 📅 1997 🏛 John Wiley and Sons 🌐 English ⚖ 230 KB 👁 2 views

The numerical modelization of the electrical connection between a wire and an arbitrarily shaped body is analyzed. Se¨eral theoretical approaches are discussed and the principal steps for a rigorous treatment are underlined. Measured data on canonical configurations of wire-to-surface junctions are