Numerical analyses of peel demolding for UV embossing of high aspect ratio micro-patterning

✍ Scribed by L. P. Yeo; S. C. Joshi; Y. C. Lam; Mary B. Chan-Park; D. E. Hardt

• Publisher: Springer-Verlag
• Year: 2009
• Tongue: English
• Weight: 853 KB
• Volume: 15
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s00542-008-0760-7