✦ LIBER ✦

Novel materials for electronic packaging and thermal management

✍ Scribed by Warren H. Hunt; M. K. Premkumar

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Advances in composite materials for ther

✍ Carl Zweben 📂 Article 📅 1998 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 287 KB

Conference on materials for electronic p

📂 Article 📅 1991 🏛 Elsevier Science 🌐 English ⚖ 77 KB

Advances in thermal management materials

✍ Sungho Jin 📂 Article 📅 1998 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 275 KB

Materials for high-density electronic pa

📂 Article 📅 1991 🏛 Elsevier Science ⚖ 470 KB

Applications of advanced composites for

✍ John Glatz; D.L. Vrable 📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 704 KB

Investigation of thermal management mate

✍ Sabuj Mallik; Ndy Ekere; Chris Best; Raj Bhatti 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 481 KB