Nondestructive Infrared Inspection of Hybrid Microcircuit Substrate-to-Package Thermal Adhesive Bonds

✍ Scribed by Kallis, J.; Egan, G.; Wirick, M.

• Book ID: 117911377
• Publisher: IEEE
• Year: 1981
• Tongue: English
• Weight: 496 KB
• Volume: 4
• Category: Article
• ISSN: 0148-6411
• DOI: 10.1109/tchmt.1981.1135806