✦ LIBER ✦
Nondestructive infrared inspection of hybrid microcircuit substrate-to-package thermal adhesive bonds: James M. Kallis, Georgette S. Egan and Michael P. Wirick IEEE Trans. Components Hybrids Mfg Technol.CHMT-4 (3), 257 (1981)
- Book ID
- 104157226
- Publisher
- Elsevier Science
- Year
- 1984
- Tongue
- English
- Weight
- 102 KB
- Volume
- 15
- Category
- Article
- ISSN
- 0026-2692
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