✍ Scribed by Y. C. Chan; X. Dai; G. C. Jin; N. K. Bao; P. S. Chung
No coin nor oath required. For personal study only.
The use of an impro¨ed digital speckle correlation method ( ) DSCM was demonstrated for the in situ and nondestructi¨e detection of delaminations in layered-structure microcomponents such as multi-( ) layer ceramic capacitors MLCs in surface-mount printed circuit board assemblies. The delaminations in MLCs that contributed to thermal displacements on the MLC surface after electrical loading could be uniquely identified using the impro¨ed DSCM, with the help of a double-lens arrangement. The method was found to be ¨ery sensiti¨e to the thermal displacement of the MLS surface after electrical loading. A resolution of better than 20 nm in surface deformation measurements has been achie¨ed within 0.01 pixel resolutions. The delamination in a MLC, as obtained by this method, correlates well with destructi¨e physical analyses performed on the respecti¨e samples.
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