Non-woven Aramid Reinforcement for Printed Wiring Boards
โ Scribed by Gary L. Hendren; Birol Kirayoglu; David J. Powell; Michael Weinhold
- Publisher
- John Wiley and Sons
- Year
- 1998
- Tongue
- English
- Weight
- 169 KB
- Volume
- 10
- Category
- Article
- ISSN
- 0935-9648
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
In the current manufacturing of printed wiring boards (PWBs), micro-drills are generally used to make smaller diameter through-holes in PWBs, which are desired for the miniaturization of equipment. However, a problem has emerged in that copper plating degraded by hole drilling can reduce the reliabi
As the electronic products are desired to have many functions with low weight and small size increasingly, the ultra-thin and multi-layer printed circuit boards (PCBs) are required to be used extensively in electronic packaging assemblies. Usually, these multi-layer PCBs consist of multiple layers o