✦ LIBER ✦
Reliability and wirability optimizations for module placement on a convectively cooled printed wiring board
✍ Scribed by Jing Lee; Jung-Hua Chou; Shen-Li Fu
- Publisher
- Elsevier Science
- Year
- 1995
- Tongue
- English
- Weight
- 756 KB
- Volume
- 18
- Category
- Article
- ISSN
- 0167-9260
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