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Non-Newtonian Flow Formulation of the Underfill Process in Flip-Chip Packaging

✍ Scribed by Wen-Bin Young

Book ID
119815873
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
464 KB
Volume
1
Category
Article
ISSN
2156-3950

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πŸ“œ SIMILAR VOLUMES

Numerical simulation of conventional cap
Numerical simulation of conventional capillary flow and no-flow underfill in flip-chip packaging
✍ Tomohisa Hashimoto; Tanifuji Shin-ichiro; Koji Morinishi; Nobuyuki Satofuka πŸ“‚ Article πŸ“… 2008 πŸ› Elsevier Science 🌐 English βš– 398 KB

We developed a numerical method for simulating the underfill flow of conventional capillary flow and no-flow types in flip-chip packaging. The analytical models for the two types of underfill encapsulation processes are proposed. In the capillary flow type, the underfill material is driven into the

Study on the Curing Process and the Gela
Study on the Curing Process and the Gelation of Epoxy/Anhydride System for No-Flow Underfill for Flip-Chip Applications
✍ Zhuqing Zhang; Erin Beatty; C. P. Wong πŸ“‚ Article πŸ“… 2003 πŸ› John Wiley and Sons 🌐 English βš– 250 KB

## Abstract No‐flow underfill is used in the assembly of microelectronics to increase the productivity and to decrease the cost of the flip‐chip manufacturing. The curing process, especially the gelation of the no‐flow underfill, is essential for the yield and reliability of the flip‐chip assembly.