𝔖 Bobbio Scriptorium
✦   LIBER   ✦

New resin challenges phenolic and epoxy


Book ID
116052405
Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
140 KB
Volume
39
Category
Article
ISSN
0034-3617

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Adhesives and coatings based on phenolic
✍ A. M. Motawie; E. M. Sadek 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 109 KB

Low molecular weight epoxy resin based on bis (4hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol±, cresol±, resorcinol±and salicylic acid± formaldehyde resins were used. The optimum conditions of formulation and curing process were

Characterization of imidazole-cured epox
✍ M. S. Heise; G. C. Martin; J. T. Gotro 📂 Article 📅 1991 🏛 John Wiley and Sons 🌐 English ⚖ 792 KB

## Abstract The physical and chemical properties of the diglycidyl ether of bisphenol A (DGEBA) cured with different concentrations of bisphenol A (BPA) and 2‐ethyl‐4‐methylimidazole (EMI‐24) were examined using Fourier transform infrared spectroscopy, differential scanning calorimetry, dynamic mec