Adhesives and coatings based on phenolic/epoxy resins

✍ Scribed by A. M. Motawie; E. M. Sadek

• Publisher: John Wiley and Sons
• Year: 1999
• Tongue: English
• Weight: 109 KB
• Volume: 10
• Category: Article
• ISSN: 1042-7147
• DOI: 10.1002/(sici)1099-1581(199904)10:4<223::aid-pat865>3.0.co;2-7

✦ Synopsis

Low molecular weight epoxy resin based on bis (4hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenol±, cresol±, resorcinol±and salicylic acid± formaldehyde resins were used. The optimum conditions of formulation and curing process were studied to obtain modified wood adhesives characterized by high tensile shear strength values. This study indicated that the more suitable conditions are 1:2 weight ratio of phenol±or cresol±formaldehyde to epoxy resin in the presence of phthalic anhydride (20 wt%) of the resin content as a curing agent at 150°C for 80 min. Resorcinol±or salicylic acid±formaldehyde/epoxy resins formulated at 1:2 weight ratio were cured in the presence of paraformaldehyde (20 wt%) at 150°C for 60 min. The effect of the structure of phenolic resins on the tensile shear strength values of formulated resin samples, when mixed with the epoxy resins and cured under the previously mentioned optimum conditions for different times, was investigated. Metallic and glass coatings from the previous resins were also prepared and evaluated as varnishes or paints.