Low molecular weight epoxy resin based on bis (4hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. Phenolยฑ, cresolยฑ, resorcinolยฑand salicylic acidยฑ formaldehyde resins were used. The optimum conditions of formulation and curing process were
โฆ LIBER โฆ
Nanoclay and long-fiber-reinforced composites based on epoxy and phenolic resins
โ Scribed by Gang Zhou; Siva Movva; L. James Lee
- Publisher
- John Wiley and Sons
- Year
- 2008
- Tongue
- English
- Weight
- 635 KB
- Volume
- 108
- Category
- Article
- ISSN
- 0021-8995
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