New process of electroplate Sn bumping on TSV without a PR mould for 3D-chip stacking

✍ Scribed by Jiheon Jun; Inrak Kim; Jaepil Jung; Y. Norman Zhou

• Book ID: 107662127
• Publisher: TechnoPress
• Year: 2011
• Tongue: English
• Weight: 1016 KB
• Volume: 17
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/s12540-011-0817-5