Fabrication of electroplate Sn-Ag bumps without a lithography process for 3D packaging

✍ Scribed by Jun, Jiheon; Park, Jun Kyu; Jung, Jae Pil

• Book ID: 113106772
• Publisher: TechnoPress
• Year: 2012
• Tongue: English
• Weight: 738 KB
• Volume: 18
• Category: Article
• ISSN: 1598-9623
• DOI: 10.1007/s12540-012-3016-0