𝔖 Bobbio Scriptorium

✦ LIBER ✦

New low cost high-performance thick-film resistor paste : B. Greenstein. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 436

Publisher: Elsevier Science
Year: 1972
Tongue: English
Weight: 112 KB
Volume: 11
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(72)90804-9

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thick-film resistor adjustment by high v

Thick-film resistor adjustment by high voltage discharge : R. P. Himmel. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971,) p. 504

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 222 KB

Wire bonds of thick-film conductors : S.

Wire bonds of thick-film conductors : S. Goldfarb. Proc. 21st Electronics Components Conf., Washington DC, USA, 10–12 May (1971), p. 295

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 111 KB

Adhesive strength of thick-film PdAg co

Adhesive strength of thick-film PdAg conductors : G. P. Wirtz. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 480

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 103 KB

Failure modes in thick-film hybrids : V.

Failure modes in thick-film hybrids : V. K. Gundotera. Proc. 21st Electronics Components Conf., Washington DC, USA, 10–12 May (1971), p. 468

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 109 KB

The effects of trimming methods on curre

The effects of trimming methods on current noise in thick-film resistors : C. Y. Kuo. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 389

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 219 KB

A new high-performance co-firable paste

A new high-performance co-firable paste system : A. H. Danis, P. J. Mangiafico and M. L. Topfer. Proc. 21st Electronic Components Conf., Washington DC, USA, 10–12 May (1971), p. 442

📂 Article 📅 1972 🏛 Elsevier Science 🌐 English ⚖ 103 KB