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New cameras for high speed laboratory use

Publisher
Elsevier Science
Year
1958
Tongue
English
Weight
149 KB
Volume
266
Category
Article
ISSN
0016-0032

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We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured