Nanoporous SiLK® Dielectric Films Prepared from Free-Radical Graft Polymerization and Thermolysis

✍ Scribed by Yiwang Chen; Lie Chen; Xiaofeng Wang; Xiaohui He

• Book ID: 102488055
• Publisher: John Wiley and Sons
• Year: 2005
• Tongue: English
• Weight: 208 KB
• Volume: 206
• Category: Article
• ISSN: 1022-1352
• DOI: 10.1002/macp.200500371

✦ Synopsis

Abstract

Summary: Thermally‐initiated free‐radical graft polymerization of poly(ethylene glycol) methyl ether methacrylate (PEGMA) with the ozone‐pretreated SiLK® precursor was carried out. The chemical composition and structure of the graft copolymers were characterized by NMR and X‐ray photoelectron spectroscopy (XPS). Nanoporous low dielectric constant (κ) SiLK films were prepared by solution spin‐casting of the graft copolymers on the Si(100) substrates, followed by thermally‐induced cycloaddition and cross‐linking of the SiLK precursor and thermal decomposition of the labile PEGMA side chains. The nanoporous SiLK films so‐obtained had well‐preserved SiLK backbones and pore size in the range of 10–15 nm. The refractive index (RI) of resulting films has decreased to 1.47, from 1.62 for the pristine (non‐porous) SiLK dielectric film. A dielectric constant of about 2.2 was achieved from thermolysis of the SiLK graft copolymer containing about 15.2 wt.‐% of the PEGMA side chains.

Preparation of the nanoporous SiLK dielectric film.

magnified imagePreparation of the nanoporous SiLK dielectric film.