✦ LIBER ✦

Nanopackaging || Carbon Nanotubes for Thermal Management of Microsystems

✍ Scribed by Morris, James E.

Book ID: 120196791
Publisher: Springer US
Year: 2008
Weight: 546 KB
Category: Article
ISBN: 0387473262
DOI: 10.1007/978-0-387-47325-3_17

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Nanopackaging || Characteristics of Carb

Nanopackaging || Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications

✍ Morris, James E. 📂 Article 📅 2008 🏛 Springer US ⚖ 702 KB

Carbon nanotube composites for thermal m

Carbon nanotube composites for thermal management

✍ Biercuk, M. J.; Llaguno, M. C.; Radosavljevic, M.; Hyun, J. K.; Johnson, A. T.; 📂 Article 📅 2002 🏛 American Institute of Physics 🌐 English ⚖ 336 KB

Nanopackaging || Electromagnetic Shieldi

Nanopackaging || Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes

✍ Morris, James E. 📂 Article 📅 2008 🏛 Springer US ⚖ 770 KB

Aligned Carbon Nanotube Composite Films

Aligned Carbon Nanotube Composite Films for Thermal Management

✍ H. Huang; C. H. Liu; Y. Wu; S. Fan 📂 Article 📅 2005 🏛 John Wiley and Sons 🌐 English ⚖ 400 KB 👁 2 views

Thermal Properties of Carbon Nanotube–Co

Thermal Properties of Carbon Nanotube–Copper Composites for Thermal Management Applications

✍ Ke Chu; Hong Guo; Chengchang Jia; Fazhang Yin; Ximin Zhang; Xuebing Liang; Hui C 📂 Article 📅 2010 🏛 Springer-Verlag 🌐 English ⚖ 742 KB

Pursuit of Future Interconnect Technolog

Pursuit of Future Interconnect Technology with Aligned Carbon Nanotube Arrays [Nanopackaging]

✍ Yang Chai; Minghui Sun; Zhiyong Xiao; Yuan Li; Min Zhang; Chan, P.C.H. 📂 Article 📅 2011 🏛 Institute of Electrical and Electronics Engineers 🌐 English ⚖ 655 KB