Pursuit of Future Interconnect Technology with Aligned Carbon Nanotube Arrays [Nanopackaging]

✍ Scribed by Yang Chai; Minghui Sun; Zhiyong Xiao; Yuan Li; Min Zhang; Chan, P.C.H.

• Book ID: 114583428
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2011
• Tongue: English
• Weight: 655 KB
• Volume: 5
• Category: Article
• ISSN: 1932-4510
• DOI: 10.1109/mnano.2010.939831