✍ Scribed by L. Häggström; J. Gullman; T. Ericsson; R. Wäppling
No coin nor oath required. For personal study only.
📜 SIMILAR VOLUMES
Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and
Mössbauer spectroscopy measurements were made to observe alloy formation and interaction of tin with the alumina support in two \(\mathrm{Pt}-\mathrm{Sn} /\) alumina catalysts. The catalysts were rich in tin with an atomic ratio of \(\mathrm{Pt}: \mathrm{Sn}=0.7: 1\). One was prepared by coimpregnat
Tu-mckel electrodeposlted alloys were stuched by the help of Mossbauer spectroscopy and energy dlsperslve X-ray fluorescence The tm phase composltlon consisted of N@n, mtermetalhc compound, elemental tm and t+,Sn, formed at the Interface of the copper substrate Increments of the quantity of mckel m