Mössbauer studies on electrodeposited ti
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J. Jaén; A. Vértes; K.M. Tjutina; L.V. Kasmodamianskaya; L. Kiss; E.V. Shepeleva
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Article
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1985
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Elsevier Science
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English
⚖ 354 KB
Electrodeposited copper-tin alloys were prepared using a tripolyphosphate electrolyte. MBssbauer spectra revealed that a Sn(IV) compound and &II&I were components of the alloys obtained in the deposition range. -250 to -550mV (us nhe). At -770 mV (us nhe) a Sn(IV) species j-Cu-Sn alloy, q-Cu,Sn, and