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Multiple film cracking in film/substrate systems with mismatch strain and applied strain

โœ Scribed by X. C. Zhang; F. Z. Xuan; Y. K. Zhang; S. T. Tu


Book ID
126660281
Publisher
American Institute of Physics
Year
2008
Tongue
English
Weight
643 KB
Volume
104
Category
Article
ISSN
0021-8979

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Multilayer thin films/substrate system w
โœ D. Ngo; X. Feng; Y. Huang; A.J. Rosakis ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 279 KB

Current methodologies used to infer thin-film stress from curvature measurements are strictly restricted to stress and curvature states that are assumed to remain uniform over the entire film/substrate system. These methodologies have recently been extended to a single thin film of non-uniform thick