✦ LIBER ✦

Multichip packaging and the need for new materials

✍ Scribed by J. W. Balde

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

New multichip-on-silicon packaging schem

✍ L. Guérin; M.A. Schaer; R. Sachot; M. Dutoit 📂 Article 📅 1996 🏛 Elsevier Science 🌐 English ⚖ 391 KB

Materials issues in the multichip module

✍ D. B. Knorr; D. R. Frear; W. L. Winterbottom 📂 Article 📅 1992 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 356 KB

Multichip MMIC package for X and Ka band

✍ Decker, D.R.; Olson, H.M.; Tatikola, R.; Gutierrez, R.; Mysoor, N.R. 📂 Article 📅 1997 🏛 IEEE 🌐 English ⚖ 134 KB

New materials for food packaging—The fut

✍ J.H. Briston 📂 Article 📅 1982 🏛 Elsevier Science 🌐 English ⚖ 491 KB

Evaluation of polyimides as dielectric m

✍ Lin, A.W. 📂 Article 📅 1990 🏛 IEEE 🌐 English ⚖ 596 KB

New concentrates improve protection for

📂 Article 📅 2001 🏛 Elsevier Science 🌐 English ⚖ 391 KB