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Multi-layer thin-film substrates for multi-chip packaging

✍ Scribed by Chao, C.C.; Scholz, K.D.; Leibovitz, J.; Cobarruviaz, M.; Chang, C.C.

Book ID: 117872609
Publisher: IEEE
Year: 1989
Tongue: English
Weight: 607 KB
Volume: 12
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.31422

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