✦ LIBER ✦
Multi-layer thin-film substrates for multi-chip packaging : Clinton C. Chao, Kenneth D. Scholz, Jacques Leibovitz, Maria Cobarruviaz and Cheng C. Chang. IEEE Trans. Compon. Hybrids mfg Technol.12(2), 180 (1989)
- Book ID
- 103283485
- Publisher
- Elsevier Science
- Year
- 1990
- Tongue
- English
- Weight
- 132 KB
- Volume
- 30
- Category
- Article
- ISSN
- 0026-2714
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