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Monitoring the Change of Viscosity During Cure Reaction of Epoxy Resins with Resin Position Sensor

✍ Scribed by Kim, Jung Gon; Shin, Kyoung Hoon; Ryu, Ho Seok; Lee, Jae Wook

Book ID: 118261287
Publisher: SAGE Publications
Year: 2002
Tongue: English
Weight: 216 KB
Volume: 21
Category: Article
ISSN: 0731-6844
DOI: 10.1177/0731684402021002353

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