Molecular dynamics simulation of void electromigration under a high-density electric current stress in an aluminum interconnection

✍ Scribed by Shoso Shingubara; Isao Utsunomiya; Taizo Fujii

• Book ID: 112079092
• Publisher: John Wiley and Sons
• Year: 1995
• Tongue: English
• Weight: 913 KB
• Volume: 78
• Category: Article
• ISSN: 8756-663X
• DOI: 10.1002/ecjb.4420781211