Interaction of a void and a grain boundary under a high electric current stress employing three-dimensional molecular dynamics simulation

✍ Scribed by Shoso Shingubara; Isao Utsunomiya; Takayuki Takahagi

• Book ID: 103618653
• Publisher: Elsevier Science
• Year: 1995
• Tongue: English
• Weight: 789 KB
• Volume: 91
• Category: Article
• ISSN: 0169-4332
• DOI: 10.1016/0169-4332(95)00122-0