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Molecular dynamics simulation of healing of an ellipsoid crack in copper under compressive stress

✍ Scribed by M Li; W.Y Chu; K.W Gao; L.J Qiao


Book ID
116730056
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
422 KB
Volume
58
Category
Article
ISSN
0167-577X

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