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Modeling the interfacial effect on the yield strength and flow stress of thin metal films on substrates

โœ Scribed by Rashid K. Abu Al-Rub


Book ID
108206782
Publisher
Elsevier Science
Year
2008
Tongue
English
Weight
193 KB
Volume
35
Category
Article
ISSN
0093-6413

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Copper (Cu) was sputtered onto a polyetheretherketon (PEEK) film and onto three types of polyimide (PI) films; pyromellitic dianhydride-oxydianiline (PMDA-ODA), biphenyl dianhydride-para-phenylene diamine (BPDA-PDA) and biphenyl dianhydride-oxydianiline (BPDA-ODA). All films were pre-treated with ox