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Modeling of Viscoelastic Behavior of an Epoxy Molding Compound During and After Curing

✍ Scribed by Yeong-Jyh Lin; Sheng-Jye Hwang; Huei-Huang Lee; Durn-Yuan Huang

Book ID
119815865
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
433 KB
Volume
1
Category
Article
ISSN
2156-3950

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πŸ“œ SIMILAR VOLUMES

Cure behavior of an epoxy–novolac moldin
Cure behavior of an epoxy–novolac molding compound
✍ T. H. Hsieh; A. C. Su πŸ“‚ Article πŸ“… 1992 πŸ› John Wiley and Sons 🌐 English βš– 579 KB

The isothermal cure of an epoxy-novolac molding compound was studied by means of differential scanning calorimetry (DSC) . The glass transition temperature ( T,) of the molding compound increased in an approximately linear manner with conversion (a) during the major part of the cure process. Predict