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Modeling of thermal stresses in passivated interconnects

✍ Scribed by Hsueh, Chun-Hway

Book ID
120502524
Publisher
American Institute of Physics
Year
2002
Tongue
English
Weight
424 KB
Volume
92
Category
Article
ISSN
0021-8979

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We present a finite element based analysis to determine if thermally induced stresses in inter-wafer Cu via structures in 3D ICs using BCB-bonded wafers is a potential reliability problem. Experimental information on thermal stresses or stress-induced failures of 3D ICs is not available in the liter