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Analysis of average thermal stresses in passivated metal interconnects

✍ Scribed by Wikström, A.; Gudmundson, P.; Suresh, S.


Book ID
121188738
Publisher
American Institute of Physics
Year
1999
Tongue
English
Weight
397 KB
Volume
86
Category
Article
ISSN
0021-8979

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Mechanical stress evolution in metal int
✍ Young-Bae Park; In-Su Jeon 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 642 KB

Both X-ray diffraction and finite element analyses were used to investigate the effects of various passivation dielectrics and metal line aspect ratios on the mechanical stress in Al-Cu interconnect lines. Volume-averaged stresses were measured and calculated by considering not only residual stresse