The elastic stress distribution resulting from thermal mismatch in a film/graded layer/substrate system is a critical issue. Recently by a three-variable method Hsueh and Lee formulated a closed-form analytical solution [Hsueh CH, Lee S. Modeling of elastic thermal stresses in two materials joined b
โฆ LIBER โฆ
Modeling of elastic thermal stresses in two materials joined by a graded layer
โ Scribed by C.H. Hsueh; S. Lee
- Publisher
- Elsevier Science
- Year
- 2003
- Tongue
- English
- Weight
- 164 KB
- Volume
- 34
- Category
- Article
- ISSN
- 1359-8368
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