An alternative model for elastic thermal
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Neng-Hui Zhang; Jian-Zhong Chen
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Article
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2010
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Elsevier Science
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English
β 381 KB
The elastic stress distribution resulting from thermal mismatch in a film/graded layer/substrate system is a critical issue. Recently by a three-variable method Hsueh and Lee formulated a closed-form analytical solution [Hsueh CH, Lee S. Modeling of elastic thermal stresses in two materials joined b