๐”– Bobbio Scriptorium
โœฆ   LIBER   โœฆ

Modeling Investigation of the Oxidation Kinetics of Copper and Aluminum Alloys

โœ Scribed by Jin, Feng; Luo, Qun; Zhou, Biao; Li, Qian


Book ID
120475682
Publisher
Trans Tech Publications, Ltd.
Year
2011
Tongue
English
Weight
283 KB
Volume
402
Category
Article
ISSN
1662-8958

No coin nor oath required. For personal study only.


๐Ÿ“œ SIMILAR VOLUMES


Kinetics of oxidation of copper alloy le
โœ S.K. Lahiri; N.K. Waalib Singh; K.W. Heng; L. Ang; L.C. Goh ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 451 KB

Delamination of the oxide film from copper alloy leadframes is considered a serious reliability problem for microelectronics packages. In an effort to identify the factors which may lead to the formation of brittle and/or poorly adhering oxides, [finetics of oxidation of leadframes in air was invest