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Kinetics of oxidation of copper alloy leadframes

✍ Scribed by S.K. Lahiri; N.K. Waalib Singh; K.W. Heng; L. Ang; L.C. Goh

Publisher
Elsevier Science
Year
1998
Tongue
English
Weight
451 KB
Volume
29
Category
Article
ISSN
0026-2692

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✦ Synopsis

Delamination of the oxide film from copper alloy leadframes is considered a serious reliability problem for microelectronics packages. In an effort to identify the factors which may lead to the formation of brittle and/or poorly adhering oxides, [finetics of oxidation of leadframes in air was investigated by measuring the oxide thickness as a function of time at temperatures ranging from 200 to 300Β°C. The oxidation was found to occur fairly rapidly in this temperature range. The oxide has the appearance of incoherent platelets and it consists of CuO and Cu20. Analysis of the oxidation data indicates a logarithmic growth law in the 100-1400nm thickness range, and an activation energy of about 19kJ/mol, which is much smaller than that reported for the oxidation of unalloyed copper by a diffusion mechanism. The results of this investigation are presented here, indicating the important role of defects in the oxidation of leadframes.

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