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Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication

✍ Scribed by M. Worgull; J. -F. Hétu; K. K. Kabanemi; M. Heckele


Publisher
Springer-Verlag
Year
2006
Tongue
English
Weight
483 KB
Volume
12
Category
Article
ISSN
0946-7076

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