Modeling and Application of Flexible Electronics Packaging

✍ Scribed by YongAn Huang, Zhouping Yin, Xiaodong Wan

Publisher: Springer Singapore
Year: 2019
Tongue: English
Leaves: 297
Edition: 1st ed.
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

✦ Table of Contents

Front Matter ....Pages i-xvii
Advanced Electronic Packaging (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 1-27
Interfacial Modeling of Flexible Multilayer Structures (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 29-48
Measurement of Fracture Strength of Ultra-thin Silicon Chip and Adhesive Fracture Energy (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 49-71
Tension-Assisted Peeling (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 73-103
Single-needle Peeling (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 105-138
Multi-needle Peeling (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 139-164
Conformal Peeling (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 165-200
Laser Lift-off (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 201-225
Vacuum-Based Picking-up and Placing-on (YongAn Huang, Zhouping Yin, Xiaodong Wan)....Pages 227-279
Back Matter ....Pages 281-287

✦ Subjects

Engineering; Electronics and Microelectronics, Instrumentation; Optical and Electronic Materials; Theoretical and Applied Mechanics

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