Flexible Electronic Packaging and Encapsulation Technology

✍ Scribed by Hong Meng (editor), Wei Huang (editor)

• Publisher: Wiley-VCH
• Year: 2024
• Tongue: English
• Leaves: 372
• Edition: 1
• Category: Library

✦ Synopsis

Flexible Electronic Packaging and Encapsulation Technology

A systematic introduction to the future of electronic packaging

Electronic packaging materials are among the most important components of the broader electronics industry, capable of facilitating heat dissipation, redistributing stress on electronic components, and providing environmental protections for electronic systems. Recent advances in integrated circuits, especially the development of flexible electronic technology, have placed increasingly stringent demands on the capabilities of electronic packaging. These technologies have the potential to reshape our world, and they demand a generation of engineers capable of harnessing that potential.

Flexible Electronic Packaging and Encapsulation Technology meets this demand with an introduction to the cutting-edge technologies available to package electronic components, as well as the testing methods and applications that bring these technologies to bear on the industry. These packaging technologies promise to bring lightness, flexibility, and environmental friendliness to the next generation of electronic systems.

Flexible Electronic Packaging and Encapsulation Technology readers will also find:

• Survey of commercial electronic packaging materials and patents for reference purposes
• Guidelines for designing high-performance packaging materials with novel structures
• An authorial team of leading researchers in the field

Flexible Electronic Packaging and Encapsulation Technology is ideal for materials scientists, electronics engineers, solid state physicists, professionals in the semiconductor industry, and any other researchers or professionals working with electronic systems.

✦ Table of Contents

fmatter
Title Page
Copyright
Contents
Preface
ch1
1.1 Flexible Electronics Overview
1.2 Development of Flexible Electronic Encapsulating Technology
1.2.1 Flip Chip Process
1.2.2 Progress of CIF‐Based Flexible Electronic Encapsulating Technology
1.3 Encapsulating Technology of Several Important Flexible Electronic Devices
1.3.1 Organic Light‐Emitting Diode
1.3.2 Flexible Solar Cell Encapsulating
1.3.3 Flexible Amorphous Silicon Solar Cells
1.3.4 Flexible Perovskite Solar Cells
1.4 Flexible Electronic Encapsulating Materials
1.4.1 Selection Principle of Flexible Electronic Encapsulating Materials
1.4.2 Desirable Properties of Flexible Electronic Encapsulating Materials
1.5 Overview of the Development of Flexible Electronic Packaging at Home and Abroad
References
ch2
2.1 Composition of Flexible Electronic Packaging
2.1.1 Flexible Substrate
2.1.2 Electronic Components
2.1.3 Crosslinked Conductive Materials
2.1.4 Adhesive Layer
2.1.5 Coating Layer
2.2 Flexible Electronic Packaging Structure
2.2.1 Curved Structures of Hard Thin Films
2.2.2 Island‐Bridge Structure
2.2.3 Pre‐strained Super‐Soft Interconnect Structure
2.2.4 Open Grid Structure
2.3 Encapsulation Principle
2.3.1 Basic Principle of Penetration
2.3.2 Permeation Mechanism of Water Vapor and Gas
2.3.3 Barrier Performance Measurement
2.3.4 Thin‐Film Barrier Technology for Organic Devices
2.3.4.1 Single‐Layer Film Package
2.3.4.2 Multilayer Film Packaging
2.3.5 Film Encapsulation Mechanics
2.4 Packaging Technology
2.4.1 Local Multilayer Packaging
2.4.2 Multilayer Barrier Film Packaging
2.4.3 Online Thin‐Film Encapsulation
2.4.4 Atomic Layer Deposition (ALD) Encapsulation
2.4.5 Inkjet Packaging
2.4.6 Flexible Glass Packaging
2.5 Packaging Stability
2.6 Encapsulated Products
2.7 Chapter Summary
References
ch3
3.1 Concept and Connotation of Flexible Substrates
3.2 Development History of Flexible Substrates
3.3 Flexible Substrate Materials
3.3.1 Polydimethylsiloxane
3.3.2 Polyvinyl Alcohol
3.3.3 Polycarbonate
3.3.4 Polyester
3.3.5 Polyimide
3.3.6 Polyurethane
3.3.7 Parylene
3.3.8 Liquid Crystal Polymer
3.3.9 Hydrogel
3.4 Molding Technology of Flexible Substrate
3.4.1 Coating Technology
3.4.1.1 Dip Coating Method
3.4.1.2 Air Knife Coating Method
3.4.1.3 Scraper Coating Method
3.4.1.4 Rotary Coating Method
3.4.2 Melt Extrusion Molding
3.4.3 Melt Extrusion Blow Molding
3.4.4 Solution Tape Casting
3.4.5 Bidirectional Drawing Molding
3.4.6 Chemical Vapor Deposition
3.5 Performance Evaluation of Flexible Substrates
3.5.1 Mechanical Flexibility
3.5.2 Ductility
3.5.3 Adhesive Property
3.5.4 Barrier Property
3.5.5 Electrical Property
3.5.6 Chemical Stability
3.5.7 Dimensional Stability
3.5.8 Surface Smoothness and Thickness Uniformity
3.5.9 Optical Clarity (Transmittance)
3.5.10 Biocompatibility
3.5.11 Bioabsorbability
3.6 Application of Flexible Substrates
3.6.1 Flexible Display Substrates
3.6.2 Flexible Electrode Substrates
3.6.3 Flexible Sensing Substrates
3.7 Development Trend of Flexible Substrates
3.7.1 Intelligent and Functional Flexible Substrates
3.7.2 Green Degradable Flexible Substrates
3.7.3 Optimization of Interface Compatibility of Flexible Substrates
References
ch4
4.1 Sealing Test
4.1.1 Direct Diffusion Method
4.1.1.1 Weight Cup Test
4.1.1.2 Differential Pressure Method
4.1.1.3 Balancing Method
4.1.1.4 Tunable Diode Laser Absorption Spectrometry
4.1.1.5 Isotope Labeling Mass Spectrometry
4.1.2 Indirect Optical Method
4.1.3 Indirect Electrical Method
4.1.3.1 Calcium Electrical Test
4.1.3.2 Dielectric Measurement Method
4.1.4 Indirect Electrochemical Method
4.1.4.1 Electrochemical Impedance Spectroscopy (EIS)
4.1.4.2 Leakage Current Monitoring Method (LCM)
4.1.4.3 Linear Scanning Voltammetry (LSV)
4.1.5 Indirect Electromechanical Method
4.2 Bending Test
4.2.1 Static Bending and Dynamic Bending
4.2.2 Three‐Point Bending and Four‐Point Bending
4.2.3 Push Bending and Roll Bending
4.2.3.1 Push Bending
4.2.3.2 Rolling Bend
4.3 Mechanical Performance Testing
4.4 Stability Testing
References
ch5
5.1 Inorganic Encapsulating Material
5.1.1 Metal Encapsulating Material
5.1.1.1 Copper, Aluminum
5.1.1.2 Favorable Alloys
5.1.1.3 Copper–Tungsten Alloy (Cu–W)
5.1.2 Ceramic Encapsulating Material
5.1.2.1 Al2O3 Ceramic Encapsulation Material
5.1.2.2 AlN Ceramic Encapsulation Materials
5.1.2.3 BeO Ceramic Encapsulation Material
5.1.2.4 BN Ceramic Encapsulation Materials
5.1.3 New Trend in Inorganic Encapsulating Materials Combined with Flexible Electronic Technology
5.2 Organic Encapsulating Material
5.2.1 Polymer Encapsulating Material
5.2.1.1 Epoxy Resins
5.2.1.2 Polyimide Resins
5.2.1.3 Organic Silicon
5.2.1.4 Bismaleimide
5.2.1.5 Bismaleimide Triazine Resin
5.2.2 Development Trend of Organic Encapsulating Materials in Flexible Electronic Devices
5.3 Organic–Inorganic Hybrid Encapsulating Material
5.3.1 Application of Organic–Inorganic Hybrid Materials in Flexible Electronics
5.3.1.1 Strain and Pressure Sensors
5.3.1.2 Temperature Sensor
5.3.1.3 Humidity Sensor
5.3.1.4 Optical Sensors
5.3.1.5 Other Types of Sensing Devices
5.3.2 Development Trends of Organic–Inorganic Hybrid Materials
References
ch6
6.1 Flexible Electronics Packaging
6.1.1 Single‐Layer Thin‐Film Packaging
6.1.2 Multi‐Layer Thin‐Film Packaging
6.1.2.1 Barix Multilayer Thin‐Film Packaging
6.1.2.2 Other Multilayer Thin‐Film Packaging
6.2 Thin‐Film Packaging Technology
6.2.1 PECVD Atomic Layer Deposition Packaging Technology
6.2.1.1 Introduction to PECVD Technology
6.2.1.2 Development of PECVD Technology
6.2.2 ALD Atomic Layer Deposition Packaging Technology
6.2.2.1 Introduction to ALD Technology
6.2.2.2 Development of ALD Technology
6.2.3 Inkjet Packaging Technology
6.2.3.1 Introduction to Inkjet Encapsulation Technology
6.2.3.2 Continuous Inkjet Printing
6.2.3.3 Drop‐on‐Demand Inkjet Printing
6.2.3.4 Development of Inkjet Printing Technology
References
ch7
7.1 Industry Chain Analysis of Flexible Electronics Packaging
7.1.1 Upstream, Midstream, and Downstream of the Flexible Electronics Industry Chain
7.1.2 Overview of the Development of Flexible Packaging Materials
7.2 Packaging Applications of Flexible OLED Devices
7.2.1 Stability Issues of Flexible OLED Devices
7.2.2 Flexible OLED Packaging Technology
7.2.2.1 Lack of Breakthrough in Encapsulating Technology
7.2.2.2 Low Yield Rate
7.3 Packaging Applications for Flexible Solar Cells
7.3.1 Inorganic Flexible Solar Cells
7.3.2 Organic Flexible Solar Cells
7.3.3 Dye‐Sensitized Solar Cells
7.3.3.1 Structure of Dye‐Sensitized Solar Cells
7.3.3.2 Light Anode
7.3.3.3 Counter Electrode
7.4 Packaging Applications for Flexible Electronic Devices
7.4.1 Basic Structure of Flexible Electronic Devices
7.4.2 Application of Flexible Electronic Devices
7.4.2.1 Optoelectronics
7.4.2.2 Robot
7.4.2.3 Biomedical
7.4.2.4 Energy Equipment
7.5 Packaging Applications for Flexible Electronics Sensors
7.5.1 Common Materials of Flexible Sensors
7.5.1.1 Flexible Substrate
7.5.1.2 Metal Materials
7.5.1.3 Inorganic Semiconductor Materials
7.5.1.4 Organic Materials
7.5.1.5 Carbon Materials
7.5.2 Flexible Gas Sensors
7.5.3 Flexible Pressure Sensors
7.5.4 Flexible Humidity Sensor
7.5.5 Normal Sensors Compare with Flexible Sensors
References
ch8
8.1 Terminology and Alphabetic Symbols
8.1.1 Scope
8.1.2 Terms and Definitions
8.1.2.1 Terminology Classification
8.1.2.2 General Terms
8.1.2.3 Physical Characteristics Related Terms
8.1.2.4 Terms Related to Construction Elements
8.1.2.5 Symbols Related to Performances and Specifications
8.1.2.6 Terms Related to the Production Process
8.1.3 Alphabetic Symbols (Quantity Symbols/Unit Symbols)
8.1.3.1 Classification
8.1.3.2 Symbols
8.2 Mechanical Test Method (Deformation Test)
8.2.1 Cyclic Bending Test
8.2.1.1 Purpose
8.2.1.2 Testing Device
8.2.1.3 Test Procedure
8.2.1.4 Test Conditions and Reports
8.2.2 Static Bending Test
8.2.2.1 Purpose
8.2.2.2 Testing Device
8.2.2.3 Test Steps
8.2.2.4 Test Conditions and Reports
8.2.3 Combined Bending Test
8.2.3.1 Purpose
8.2.3.2 Testing Device
8.2.3.3 Test Procedure
8.2.3.4 Test Conditions and Reports
8.2.4 Rolling Test
8.2.4.1 Purpose
8.2.4.2 Testing Device
8.2.4.3 Test Procedure
8.2.4.4 Test Conditions and Reports
8.2.5 Static Rolling Test
8.2.5.1 Purpose
8.2.5.2 Testing Device
8.2.5.3 Test Procedure
8.2.5.4 Test Conditions and Reports
8.2.6 Torsion Test
8.2.6.1 Purpose
8.2.6.2 Testing Device
8.2.6.3 Test Procedure
8.2.6.4 Test Conditions and Reporting
8.2.7 Tensile Test
8.2.7.1 Purpose
8.2.7.2 Testing Device
8.2.7.3 Test Procedure
8.2.7.4 Test Conditions and Reports
8.3 Environmental Test Methods
8.3.1 Storage at High Temperature
8.3.1.1 Purpose
8.3.1.2 Test Conditions
8.3.2 Storage at Low Temperature
8.3.2.1 Purpose
8.3.2.2 Test Conditions
8.3.3 Temperature Change and Storage
8.3.3.1 Purpose
8.3.3.2 Rapid Temperature Change
8.3.3.3 Specified Rate of Temperature Change
8.3.4 Humidity and Heat, Steady State, and Storage
8.3.4.1 Purpose
8.3.4.2 Test Conditions
8.3.5 Moist Heat, Circulation, and Storage
8.3.5.1 Purpose
8.3.5.2 Test Conditions
8.3.6 High‐Temperature Operation
8.3.6.1 Purpose
8.3.6.2 Test Conditions
8.3.7 Low‐Temperature Operation
8.3.7.1 Purpose
8.3.7.2 Test Conditions
8.3.8 Humidity and Heat, Steady State, Operation
8.3.8.1 Purpose
8.3.8.2 Test Conditions
8.4 Mechanical Test Methods (Impact and Hardness Tests)
8.4.1 Scope
8.4.2 Sample Preparation
8.4.3 Ball Drop Test
8.4.3.1 Purpose
8.4.3.2 Testing Device
8.4.3.3 Test Procedure
8.4.4 Impact Test
8.4.4.1 Purpose
8.4.4.2 Test Equipment for Impact Testing
8.4.4.3 Test Process
8.4.5 Pendulum Side Impact Test
8.4.5.1 Purpose
8.4.5.2 Testing Device
8.4.5.3 Test Steps
8.4.6 Stylus Scratch Test
8.4.6.1 Purpose
8.4.6.2 Testing Device
8.4.6.3 Test Steps
8.4.7 Steel Wool Wear Test
8.4.7.1 Purpose
8.4.7.2 Testing Device
8.4.7.3 Test Procedure
References
ch9
9.1 Flexible Electronic Packaging Enterprise
9.1.1 Samsung SDI‐Korea
9.1.1.1 Product Appearance
9.1.1.2 Business History
9.1.1.3 Product Features
9.1.1.4 Product Specifications
9.1.2 LG Chem‐Korea
9.1.2.1 Basic Materials and Chemicals
9.1.2.2 Information Technology and Electronic Materials
9.1.2.3 Energy Solutions
9.1.3 3M‐United States
9.1.4 UDC‐United States
9.1.5 Amcor‐United States
9.1.6 Vitriflex‐United States
9.1.7 TBF‐Singapore
9.1.8 Fraunhofer ISC‐Germany
9.1.9 Sigma Technologies‐The United States
9.1.9.1 Monolayer Barrier Films
9.1.9.2 Multilayer Barrier Films
9.1.10 Toppan Printing‐Japan
9.1.10.1 Information Network
9.1.10.2 Living Environment
9.1.10.3 Electronics
9.1.11 BASF(Rolic)‐Germany
9.1.12 Vitex(Samsung)‐The United States
9.1.13 General Electrics‐The United States
9.1.14 Mitsui Chem‐Japan
9.1.15 Mitsubishi Chem‐Japan
9.1.16 Fujifilm‐Japan
9.1.17 Konica Minolta‐Japan
9.1.18 KDX‐China
9.1.19 Wanshun‐China
9.1.20 Lucky‐China
9.2 Analysis of Flexible Electronic Packaging Enterprises
References
ch10
10.1 Flexible Electronics Packaging Trends Overview
10.2 Introduction of Three Packaging Technologies for Flexible Electronic Devices
10.2.1 Application of Electronic Packaging Technology in the OLED Field
10.2.2 Advances in Packaging Research for Flexible Bioelectronic Implants
10.2.3 Advances in Packaging Research of Flexible Chalcogenide and Organic Photovoltaics
10.3 Flexible Electronics Packaging Development Trend Summary
References
index