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Model-based evaluation of grinding experiments

✍ Scribed by F Müller; R Polke; M Schäfer


Book ID
114080524
Publisher
Elsevier Science
Year
1999
Tongue
English
Weight
445 KB
Volume
105
Category
Article
ISSN
0032-5910

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Silicon wafers are the most widely used substrates for semiconductors. The falling price of silicon wafers has created tremendous pressure to develop cost-effective processes to manufacture silicon wafers. Fine grinding possesses great potential to reduce the overall cost for manufacturing silicon w