MODCON: a system for the CAM of dies and moulds
โ Scribed by YK Chan
- Publisher
- Elsevier Science
- Year
- 1980
- Tongue
- English
- Weight
- 120 KB
- Volume
- 12
- Category
- Article
- ISSN
- 0010-4485
No coin nor oath required. For personal study only.
โฆ Synopsis
design process as well as engineers responsible for checking designs.
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